| abstract |
(A) Epoxy resin, (B) Phenol resin, (C) Curing accelerator, (D) Inorganic filler and (E) Drop point 60-140 ° C., Acid value 10-100 mg KOH / g, Number average molecular weight 500- 20000, comprising an oxidized polyethylene wax having an average particle size of 5 to 100 μm, and (A) an epoxy resin and (B) a phenol resin, at least one of which is a novolac resin having a biphenylene group in the main chain, And (E) the epoxy resin composition for semiconductor sealing in which 0.01 to 1 weight% of oxidized polyethylene wax is contained in the total epoxy resin composition. |