| abstract |
[PROBLEMS] To provide an epoxy resin composition for semiconductor encapsulation in which the relative dielectric constant corresponding to the increase in the frequency and the gelation time are short in a situation where the frequency of the semiconductor element is increasing. . The epoxy resin composition for semiconductor encapsulation contains the following components (A) to (E) as essential components. Then, the hydroxyl group of the component (B) is adjusted to 1.02 to 1.20 equivalents with respect to 1 equivalent of the epoxy group of the component (A), and the (C) is adjusted to 1 equivalent of the epoxy group of the component (A). ) The cyanate ester group of the component is set to an equivalent ratio of 0.10 to 1.00 equivalent. (A) Epoxy resin. (B) a phenolic resin. (C) Polyvalent cyanate ester compound. (D) a curing accelerator. (E) an inorganic filler. |