http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S62167318-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
filingDate 1986-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ba7c24755cd214bd5efab172248c9df1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2205edfc410ccf7e6c3230b152bb5bb3
publicationDate 1987-07-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S62167318-A
titleOfInvention Curing of epoxy resin
abstract PURPOSE: To obtain an epoxy resin having improved storage stability and curing characteristic, by using a specific naphthol derivative as an epoxy resin curing agent. n CONSTITUTION: An epoxy compound having ≥2 epoxy groups in one molecule is cured. In the process, a naphthol derivtive having at least 2 hydroxyl groups linked to the naphthalene uncleus, preferably monohydric naphthol in the molecule, preferably a fusible and soluble compound, obtained by linking ≥2 monohydric naphthols (α-naphthol or β-naphthol) and/or a dihydric naphthols through linking chains, having normally ≤5,000 molecular weight and expressed by the formula (p is 1W2; R' is substituent group on the naphthalene uncleus; n is 0W2; R is bi- W tetrafunctional linking group of the naphthalene uncleus; m is a number for keeping the molecular weight at ≤5,000 and further fusibility in relation to R), etc., is used as an epoxy resin curing agent. n COPYRIGHT: (C)1987,JPO&Japio
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priorityDate 1986-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 44.