http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S6119645-A

Outgoing Links

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filingDate 1984-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0fc0ed173381c310dd8d5c075670b7d2
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publicationDate 1986-01-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S6119645-A
titleOfInvention Heat-resistant, transparent polyolefin resin composition
abstract PURPOSE: The titled resin composition which has high heat resistance, gives a transparent molded article suffering neither blooming nor bleeding, and is made by incorporating a specified phenolic antioxidant and a specified thioic antioxidant into a polyethylene resin. n CONSTITUTION: At least 2pts.wt. mixture of N,N'-hexamethylenebis(3,5-di-tert- butyl-4-hydrocinnamamide) (a phenolic antioxidant) and distearyl thiodipropionate (a thioic antioxidant) in a weight ratio of 1:1W6:1 is incorporated into 100pts.wt. polyethylene resin (e.g. polyethylene or an ethylene-vinyl acetate copolymer) to give the titled resin composition. n COPYRIGHT: (C)1986,JPO&Japio
priorityDate 1984-07-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 30.