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filingDate 1984-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d4f692eebe5e63e7fb43fd2e7f0ff9df
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publicationDate 1985-08-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S60155684-A
titleOfInvention Electroless copper plating solution
abstract PURPOSE:To make the rate of deposition almost independent of the pH of an electroless copper plating soln. by adding alpha,alpha'-dipyridyl, a hexacyanoferrate and an org. substance having polyethylene oxide to the plating soln. CONSTITUTION:A cupric salt, a cupric salt complexing agent, a reducing agent and a pH adjusting agent are dissolved in water to prepare an electroless copper plating soln. To the plating soln. are added proper amounts of alpha,alpha'-dipyridyl, a hexacyanoferrate (II) or (III) such as potassium ferrocyanide and an org. substance having polyethylene oxide in the molecule such as polyethylene glycol. When the pH of the resulting electroless copper plating soln. is 12.0-13.0 at 20 deg.C, the ratio of the minimum rate of deposition to the maximum rate is <=1.5, so the plating soln. is easily controlled.
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priorityDate 1984-01-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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