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filingDate 1989-01-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1990-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H02190477-A
titleOfInvention Electroless copper plating solution
abstract PURPOSE: To form a Cu plating film having superior ductility and mechanical properties by adding α,α'-dipyridyl, L-arginine and a cyano-complex compd. to an electroless Cu plating soln. n CONSTITUTION: 5-100mg/l α,α'-dipyridyl and 0.05-50mg/l L-arginine, 0.05-30mg/l cyano-complex compd. such as sodium ferrocyanide and above-mentioned L- arginine, or the cyano-complex compd., α,α'-dipyridyl and L-arginine are added to a generally used electroless Cu plating soln. contg. copper sulfate, copper nitrate or cupric chloride as a Cu ion source, Rochelle salt, 'Quadrol(R)' or EDTA as a Cu complexing agent, formaldehyde as a Cu ion reducing agent and NaOH as a pH adjusting agent for the plating soln. An electroless Cu plating soln. having superior stability and a high rate of deposition of Cu and giving a plating film having superior appearance, ductility and mechanical properties is obtd. n COPYRIGHT: (C)1990,JPO&Japio
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