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filingDate 1983-03-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b6fd51314a114ee8c9dcec29c50007db
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publicationDate 1984-09-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S59172571-A
titleOfInvention Electrically conductive adhesive
abstract PURPOSE:To provide an electrically conductive adhesive having a high bond strength at high temp. and humidity and a long pot life after coating, by mixing an epoxy resin contg. diglycidylsiloxane, a hardener and an electrically conductive material. CONSTITUTION:A liquid epoxy resin compsn. obtd. by mixing 95-40wt% epoxy resin, pref. epoxidized novolak resin with 5-60wt% diglycidylsiloxane of the formula (wherein R1, R2 are each 3C or lower alkyl, phenyl; n is 1-10) is used. Said epoxy resin compsn., a hardener such as dicyandiamide or adipic acid hydrazide and an electrically conductive material such as metallic powder having an average particle size of 0.1-10mu are kneaded in a roll mill to obtain a pasty electrically conductive adhesive.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6376051-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S63120782-A
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type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 34.