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filingDate 1980-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1981-08-10-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S5699216-A
titleOfInvention Highly adherent resin composition
abstract PURPOSE: A highly adherent resin composition of little cure shrinkage, which is prepared by mixing a specified unsaturated polyester, a dicylopentadiene resin and a polymerizable monomer having a polymerizable double bond. n CONSTITUTION: The titled resin composition is obtained by mixing (A) 30W 70pts.wt. of an unsaturated polyester, in which at least 30% of the total terminal groups is hindered by a group of the formula [wherein (n) is 0W8], (B) 2W 30pts.wt. of a dicyclopentadiene resin containing 50W100wt% of polymerized dicyclopentadien units, (C) 20W60pts.wt. of at least one polymerizable monomer having at least one polymerizable double bond in the molecule (e.g., styrene, vinyl toluene), and, if necessary, (D) 0W15pts.wt. of a thermoplastic polymer of MW 5,000W500,000 (e.g., polystyrene). The (A) component is obtained by the reaction of dicyclopentadiene, a dibasic acid, a polyhydric alcohol, etc. n COPYRIGHT: (C)1981,JPO&Japio
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priorityDate 1980-01-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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Total number of triples: 43.