http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S56114328-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2049707590aefdb998b998adad471f26
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32136
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3213
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302
filingDate 1980-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_000928a0e0dcf1ecd6b267f1c5c876b1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_39e740f2f2faf4e26f2d5efff8327771
publicationDate 1981-09-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-S56114328-A
titleOfInvention Manufacture of semiconductor device
abstract PURPOSE:To obtain a precise Al pattern, by applying a mask on an Al layer by an energy-responsive resist, treating the mask by N2 plasma, and dry-etching Al with an N2 treated layer as a mask. CONSTITUTION:The energy responsive resist mask 13 (this mask is formed on the area to be etched) is applied on the Al layer 12 on an Si substrate 11. Then, N2 plasma 55 is applied and the N2 treated layer 54 is formed. N ion implantation may be used. Then, the resistmask is removed. Al 12 is dry-etched with the layer 54 as a mask by using the plasma of CCl4 gas, and the Al pattern is obtained. In this constitution, it is not necessary to apply the energy-responsive resist thickly as in a conventional method, and the scope of selecting the resist is expanded. Furthermore, the thickness of the N2 treated layer 54 is uniform and the abnormal side etching as in the case of SiO2 does not occur.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-S61194834-A
priorityDate 1980-02-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

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isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419527288
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5943

Total number of triples: 17.