| abstract |
PURPOSE: To improve the adhesive strength of a photopolymerizable composition to a metal, by adding indazole or its derivative. n CONSTITUTION: A photopolymerizable composition comprising (A) a nongaseous ethylenic unsaturated compound (e.g. acrylic esters, etc.) having two or more terminal ethylene groups and polymerizable in the pressence of a photopolymerization initiator, (B) a thermoplastic organic polymer binder (e.g. polymethyl methacrylate, etc.), (C) a photopolymerization initiator (e.g. anthraquinone, etc.) which can be activated with actimic light, and (D) indazole or its derivative (e.g. N- methylindazole, etc.). The preferable amount of the component (D) is 0.5W2wt%. Addition of a polymerization inhibitor, e.g. p-methoxy-phenol, etc., preferably suppresses thermal polymerization during drying and storing of the resist. n COPYRIGHT: (C)1980,JPO&Japio |