| abstract |
PURPOSE: To improve the heat dissipation of an impedance device and an encapsulated IC, etc., and to reduce the size of a device, by adding boron nitride together with sintered alumina, etc. as heat-conductivity-imparting agnets, to an encapsulating resin. n CONSTITUTION: A resin composition for encapsulation of an electrical and electrononic device, composed of (A) 100 parts by weight of a resin such as epoxy resin, unsaturated polyester resin, etc., (B) pref. 1W100 parts of boron nitride, (C) pref. 5W400 parts of sintered or fused alumina, and if necessary, (D) a flame- retardant which does not evolve corrosive gas, e.g. decabromodiphenyl ether. n COPYRIGHT: (C)1980,JPO&Japio |