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filingDate 2019-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_05cccdeec0770e8f9ff2f1d152040284
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publicationDate 2020-10-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-2020176201-A
titleOfInvention Thermally conductive resin composition and cured product of thermally conductive resin
abstract PROBLEM TO BE SOLVED: To stably provide a highly thermally conductive resin composition and a cured highly thermally conductive resin, which have high thermal conductivity and a small specific gravity and are effective as a heat radiating material. A thermosetting resin composition contains 50 to 80% by volume of a thermosetting resin component, 5 to 20% by volume of boron nitride, and 10 to 45% by volume of a thermally conductive filler other than the boron nitride. Preferred boron nitride is secondary particles in which scaly boron nitride primary particles are radially aggregated. The specific gravity of the preferable thermal conductive filler is 2.0 to 6.0. The thermosetting resin cured product is a cured product of this thermosetting resin composition. [Selection diagram] None
priorityDate 2019-04-18-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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