abstract |
(57) Abstract: An object of the present invention is to provide a polishing pad for precision polishing such as for a semiconductor wafer, a liquid crystal glass, and a hard disk, particularly a polishing pad for CMP, which has sufficient hardness and wet strength, and Another object of the present invention is to provide a polishing pad excellent in dressing property. SOLUTION: In a polishing pad made of a nonwoven fabric impregnated with a high-molecular elastic polymer, the polishing pad surface has a hardness of 8%. A polishing pad characterized by being at least 5 ° and at most 99 °. |