http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H1154481-A

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http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
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filingDate 1997-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1de0822571235aa98eb0b023b1739ce3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6b671009684d14f35761d8be915b81bd
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publicationDate 1999-02-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H1154481-A
titleOfInvention Dry etching method and dry etching apparatus
abstract (57) [Summary] [PROBLEMS] To suppress a microloading effect and a side etch. SOLUTION: After a silicon oxide film 2 is formed on a semiconductor substrate 1, a polysilicon film 3 is deposited and a mask pattern is formed on the polysilicon film 3 by photolithography. A gas comprising nitrogen and hydrogen is added to a mixed gas of a gas containing nitrogen and a gas containing bromine atoms, and the polysilicon film 3 is anisotropically etched by plasma using the mixed gas using the mask pattern as a mask. 2 steps. As described above, a SiN layer having low reactivity is formed on the outermost surface of the polysilicon film 3, and the SiN layer suppresses a thermochemical reaction between Cl and Br radicals and the polysilicon film 3, thereby suppressing side etching. be able to. Further, the reaction proceeds only when an ion bombardment is applied, and the microloading effect can be reduced.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6544887-B1
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013084694-A
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priorityDate 1997-08-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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