http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11354496-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302
filingDate 1999-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_da43145866b712894e0ba6b8591141d1
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publicationDate 1999-12-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H11354496-A
titleOfInvention Dry etching method for semiconductor
abstract (57) [Summary] [PROBLEMS] To provide an effective dry etching method for Al x Ga 1-X N (0 ≦ X ≦ 1) semiconductor. A dry etching method for an Al x Ga 1-x N (0 ≦ X ≦ 1) semiconductor, wherein the Al x Ga 1- x N (0 ≦ X ≦ 1) semiconductor is substantially free of carbon atoms Etching is performed by using a plasma gas of a substance containing chlorine atoms. The above plasma etching, Usually, a parallel electrode type device in which electrodes for applying high frequency power are arranged in parallel and an object to be etched is arranged on the electrodes, This is performed using a cylindrical electrode type device in which electrodes to which high frequency power is applied are arranged in a cylindrical shape, and an object to be etched is arranged in parallel with the cross section of the cylinder, or other devices. The plasma gas of a substance containing substantially no carbon atoms but containing chlorine atoms is, for example, plasma of boron trichloride (BCl 3 ) gas.
priorityDate 1999-05-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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