| abstract |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition suitable as a solder resist composition having excellent adhesiveness to a resist film and copper and other base materials and wet heat resistance. SOLUTION: The photosensitive resin composition contains a photosensitive resin (A) having a carboxyl group, an epoxy curing agent (B) represented by the following general formula (I), and a photopolymerization initiator (C). Embedded image (Wherein, R 1 , R 2 , R 3 and R 4 represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms or an aryl group having 6 to 18 carbon atoms, respectively, and R 1 , R 2 , R 3 and R 4 At least one of 4 is an alkyl group having 1 to 4 carbon atoms or an aryl group having 6 to 18 carbon atoms, and R 5 and R 6 are each a hydrogen atom or 1 carbon atom; Represents 2 to 2 alkyl groups, and n is 0, 1, 2, or 3.) |