| abstract |
The present invention provides a resin composition having photo-curability and thermosetting, a dry film solder resist obtained from the resin composition, and a circuit board including the dry film solder resist. The resin composition having photocurability and thermosetting according to an embodiment of the present invention is an acid-modified oligomer, a photopolymerizable monomer, a thermosetting binder resin, a photoinitiator, two or more kinds having different particle sizes. Spherical alumina particles, and an organic solvent. |