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filingDate 1998-02-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1999-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H11224939-A
titleOfInvention Semiconductor device and manufacturing method thereof
abstract (57) [Problem] To provide a semiconductor device including a poly-diode element resistant to surge or contamination. SOLUTION: A resistance element (barrier metal film 32 + tungsten plug 3 The aluminum wiring 34 is connected with 3) interposed. An aluminum wiring 34 is connected to the N-type layer 37 of the poly-diode element 2 via a resistance element (barrier metal film 32 + tungsten plug 33).
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