| abstract |
An object of the present invention is to provide a method for removing organic contaminants such as a photoresist, a resist residue, and a dry etching residue generated in all processes related to semiconductor substrate fabrication from a semiconductor substrate surface. A semiconductor substrate is placed in a tank, and the tank is filled with a fluid such as a liquid or a gas. Gas-phase processes using gases use a gas mixture of water vapor, ozone and additives that act as scavengers. Liquid phase processes using liquids use a liquid mixture of water, ozone and additives that act as scavengers, and are kept at a temperature below the boiling point of the liquid. |