abstract |
(57) Abstract: A low-dielectric-constant insulating material, a mounted circuit board, and an electric solid-state device have a relative dielectric constant equal to or lower than that of a conventional dielectric material and can withstand a mounting process. Provided is a low dielectric constant insulating material having heat resistance and the like. SOLUTION: A low dielectric constant insulating material is formed by compounding a compound obtained by chemically modifying adamantane (C 10 H 16 ) with an insulating resin through a chemical bond. |