| abstract |
PROBLEM TO BE SOLVED: To provide an abrasive for semiconductors, which reduces scratches on the surface of an insulating film after polishing a semiconductor wafer, reduces the amount of remaining Na and the like, and has no growth of microorganisms even after long-term storage. . SOLUTION: The weight average particle diameter is 0.1 to 0.35 μm. A semiconductor polishing slurry containing cerium oxide particles having a crystallite diameter of 150 to 600 °. The cerium oxide particles are manufactured by wet-pulverizing high-purity cerium carbonate, drying and firing. The content of a is 10 ppm or less. |