| abstract |
(57) Abstract: Adhesion excellent in leaching control and heat resistance when used in a semiconductor device having a structure including a semiconductor chip, a flexible wiring board, and an insulating layer sandwiched therebetween. Provide a film. SOLUTION: An adhesive film for an insulating layer having a minimum viscosity by a capillary rheometer method at a heating adhesion temperature of 100 to 2000 Pa ยท s. The adhesive film for the insulating layer is It is desirable that the heating is completed after 10 to 40% of the total curing calorific value measured by DSC (differential scanning calorimetry). |