| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83101 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J163-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J133-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 |
| filingDate |
2003-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d79eccfcd34c42cf4247a1314f9be4ae |
| publicationDate |
2004-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2004281751-A |
| titleOfInvention |
Die bonding film adhesive, method of manufacturing semiconductor device using the same, and semiconductor device |
| abstract |
An object of the present invention is to provide a die attach film capable of bonding a die bonding adhesive and a film having both functions of a die attach film and a dicing film to a wafer under a mild condition of 60 ° C. or less in a semiconductor assembling process. . The peel strength between the wafer and the film adhesive when the film adhesive is adhered to the back surface of the wafer at 60 ° C. is 50 g / 25 mm or more, and preferably, the glass transition temperature of the constituent resin composition is -30 ° C or higher and 60 ° C or lower, and the resin composition is an acrylic acid copolymer having a glass transition temperature of -30 ° C or higher and 60 ° C or lower, and a film-like adhesive for die bonding comprising an epoxy resin. A die attach film with a dicing sheet function can be manufactured using the light-transmitting base material. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013197194-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2004289037-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007109808-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4661889-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006335860-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008211224-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007059936-A |
| priorityDate |
2003-03-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |