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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B9-00
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filingDate 1997-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4773f32dfd527c85ae7b9d96b0245e0a
publicationDate 1998-12-15-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H10329268-A
titleOfInvention Heat resistant substrate
abstract (57) [Problem] To provide a (1) heat-resistant substrate capable of forming fine irregularities on the surface of an insulating substrate at low cost and (2) having a high light-to-electricity conversion efficiency. SOLUTION: In a heat-resistant substrate in which a polyimide resin film is formed on the surface of a stainless steel plate, the thickness of the film is in the range of 5 to 50 μm, and the surface of the film conforms to JIS B0651. A heat-resistant substrate characterized by having a surface roughness Rmax measured in the range of 0.01 to 1.0 [mu] m and a pitch of protrusions in a range of 1 to 10 [mu] m. [Effect] The above problem is solved.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010016244-A
priorityDate 1997-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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