| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5547f741b25666fc4ae5195cf71a979b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01078
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15787
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05568
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83192
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05573
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-49144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3452
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-3436
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-4913
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73203
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-92125
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01004
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13022
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01046
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83102
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01027
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01024
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-34 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-18 |
| filingDate |
1997-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bf88fd6a0de8c8a48fd3f04d246e343f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_98042d02d5f1d0554aed124faab8da2b |
| publicationDate |
1998-12-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H10326798-A |
| titleOfInvention |
Method of connecting circuit board for mounting semiconductor element and semiconductor element |
| abstract |
PROBLEM TO BE SOLVED: To provide a method of connecting a semiconductor device with a highly reliable semiconductor device and a circuit board with excellent reliability by performing a process before connection only to the circuit board, and to provide a mounted body of the circuit board which has been subjected to a pre-connection process. . A circuit board structure in which an electrode pad portion (2) of a circuit board (1) is formed, a sealing resin having photosensitivity and thermosetting properties is applied, and a sealing resin layer patterned by an exposure phenomenon is provided. The connection between the bumps 4 of the circuit board and the electrodes 8 of the bare semiconductor chip 6 by thermocompression bonding simultaneously bonds and seals the gap between the semiconductor chip and the circuit board. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007311596-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2016111112-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4661459-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6313533-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007059815-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003318234-A |
| priorityDate |
1997-05-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |