http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007059815-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b19eaa8e535da4e4bceed99917a68153 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-52 |
| filingDate | 2005-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e0bd18a727823049d33f37bf284c4510 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d8751050e75c8654a1f4e24c2aef225 |
| publicationDate | 2007-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-2007059815-A |
| titleOfInvention | Manufacturing method of semiconductor device |
| abstract | An object of the present invention is to provide a semiconductor device manufacturing method capable of finely patterning an adhesive layer connecting a semiconductor chip and a substrate. [Solution] (1) A process of attaching an adhesive film to the substrate, (2) A process of exposing and patterning the adhesive film through the mask 4, (3) A process of developing the adhesive film after exposure, and (4) Chip Mounting in this order on the adhesive film after development on the substrate, wherein the adhesive film comprises an adhesive layer 2 and a cover film layer 3. The adhesive layer 2 includes (A) a resin having a radical polymerizable double bond, (B) a thermosetting resin, and (C) a resin having an alkali-soluble group and a double bond. According to a featured semiconductor device manufacturing method. [Selection] Figure 2 |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009141008-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101813260-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009132828-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009242771-A |
| priorityDate | 2005-08-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 74.