| abstract |
PROBLEM TO BE SOLVED: To provide a resin composition for a semiconductor interlayer insulating film which has excellent heat resistance, low dielectric constant and excellent electric characteristics. An interlayer insulating film resin composition for a semiconductor multilayer wiring comprising a fluorine-containing polybenzoxazole containing a structural unit represented by the general formula (1). A method for producing an interlayer insulating film for a semiconductor multilayer wiring, comprising applying a fluorine-containing polyhydroxyamide containing a structural unit represented by the above formula, and heating and closing the ring to obtain the above-mentioned structure. Embedded image Embedded image |