| abstract |
(57) [Problem] To provide an epoxy resin composition for semiconductor encapsulation capable of obtaining a semiconductor device having few voids and excellent in solder crack resistance. SOLUTION: Epoxy resin, phenol resin curing agent, An epoxy resin composition for semiconductor encapsulation comprising a curing accelerator, an inorganic filler, and a silane coupling agent represented by Formula 1 as essential components. R 1 : an alkyl group having 1 to 5 carbon atoms, —H, or acyl group R 2 : an aliphatic hydrocarbon having an alkyl group having 1 to 30 carbon atoms or an ether group and having a total of 2 to 30 carbon atoms A : —CH 3 or —C 2 H 5 B: —CH 3 or —C 2 H 5 a ≧ 0, b ≧ 0, 2 ≦ (a + b) ≦ 50, c = 1, 2 or 3 |