| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_129e393582e6bdf4029baf2206522f45 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L63-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J3-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00 |
| filingDate |
2001-09-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_dfea8cb62425a5390cd28d0ac2fe76b6
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1122f8f8e63aceea57ba00981791f6ce
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_40167d0c9701126f012ce61040a9454f |
| publicationDate |
2003-03-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-2003073483-A |
| titleOfInvention |
Method for producing thermosetting resin composition and semiconductor device |
| abstract |
PROBLEM TO BE SOLVED: To provide a method for producing a high-performance thermosetting resin composition having less appearance defects such as voids in a product after heat curing, and particularly to a high-performance epoxy resin composition for semiconductor encapsulation. It is an object of the present invention to provide a method of manufacturing a product and a high-performance semiconductor device obtained from the method. SOLUTION: In a thermosetting resin composition containing an inorganic filler, an inorganic filler and a coupling agent are mixed at 40 ° C or less, and then mixed with the thermosetting resin at 40 ° C or less, and further, a thermosetting resin is added. Are kneaded in a molten state. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017121505-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-109971122-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10662315-B2 |
| priorityDate |
2001-09-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |