| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9fc0a00eab3a757e8324b1e887d7ba97 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-306
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-4401
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32136
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31116 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3213
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-44
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683 |
| filingDate |
1998-01-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a450a7b821c7530aa94423ea39169afd |
| publicationDate |
1998-08-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H10223619-A |
| titleOfInvention |
Method for processing semiconductor wafers |
| abstract |
(57) [Object] To provide a method of processing a semiconductor wafer capable of accurately removing particles from a processing chamber and a substrate surface during a processing cycle without adding a large amount of time. An electrically controlled grid (250) is introduced between an isolation region (252) of a processing chamber (210) and a liner (220). The grid comprises a plurality of segments (25 0a, 250b, 250c, 250d) Power is supplied during processing of the semiconductor substrate (230), Particles suspended in the processing chamber thereby (235) Are drawn toward the grid and away from the semiconductor substrate. By changing the voltage on the grid while gas flow or depressurization is taking place in the processing chamber, the particles are electrically driven by the pumping port (23). Move toward 9). Particles are removed from the processing chamber through the pumping port. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003520429-A |
| priorityDate |
1997-02-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |