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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-812
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filingDate 1997-01-20-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e535c84f89ef93f6c829af5543818541
publicationDate 1998-08-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H10209181-A
titleOfInvention Method for manufacturing semiconductor device
abstract PROBLEM TO BE SOLVED: To obtain a clean semiconductor surface having good Schottky characteristics when dry-etching is performed using a gas containing Si and halogen, and to reproduce Vth of a desired FET with good reproducibility. Get to the value. SOLUTION: The semiconductor layer 3 is dry-etched selectively and anisotropically with respect to the etching stopper layer 2 using a gas containing Si and halogen. Thereafter, plasma irradiation is performed using H 2 gas or a gas containing F, S on the side wall of the recess 5 and the surface of the etching stopper layer 2 The i deposit 6 is removed. Next, after removing the deposits on the wafer surface with pure water or hydrochloric acid solution to expose a clean surface, a gate electrode 7 having a Schottky property is formed, and then a source electrode 8 and a drain having an ohmic property are formed. An electrode 9 is formed.
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