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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G9-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01G9-028
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B65B15-04
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filingDate 1996-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d2ebc583844a0294c63cd1b490517518
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f6e91c4a35629ca34cd8df63132b91e0
publicationDate 1998-05-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H10144575-A
titleOfInvention Chip type solid electrolytic capacitor and its packaging method
abstract (57) [Summary] [Problem] Even if a chip-type solid electrolytic capacitor is left in an environment of high temperature and high humidity for a long time, it is mounted on a circuit board and subjected to high-temperature heating for soldering. An object of the present invention is to provide a chip-type solid electrolytic capacitor that does not cause a problem in its reliability. The capacitor includes a capacitor element, a lead frame connected to the capacitor element, and an exterior resin for molding the capacitor element so as to be led out to a part of the lead frame. Is coated with a moisture-proof coating material 8.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012015384-A
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010212650-A
priorityDate 1996-11-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 34.