http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H1010743-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-11
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027
filingDate 1996-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_652bd87760ee116eaacea75860b24323
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f10189bd84037f6419b9de626cf59a18
publicationDate 1998-01-16-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H1010743-A
titleOfInvention Resin coating material and resist pattern forming method
abstract (57) Abstract: A method for forming a resin coating material and a resist pattern, wherein when a pattern is formed using a chemically amplified resist, a simple means is employed to reduce the film loss and reduce the cross section. To obtain a rectangular pattern. SOLUTION: A first heat treatment is performed after a chemically amplified resist film 2 is formed on an etching object 1, and then a water-insoluble resin having a sufficiently low water content is formed on the chemically amplified resist film 2 ( For example, a resin coating material film 7 containing a polyolefin-based polymer) and a basic compound (for example, an aromatic amine, an aliphatic amine, an alkylamine-based, etc.) is formed. A second heat treatment is performed, and then the resin coating material film 7 is peeled off and then developed.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2001166489-A
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priorityDate 1996-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 31.