| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_00247449e91da784127a524fa801e8fb |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L35-30
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L35-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-373 |
| filingDate |
1996-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fda811bda7280640ee19f53675836238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6ce4fd23df797b75fdb635c208a45ff2 |
| publicationDate |
1998-04-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H10107327-A |
| titleOfInvention |
Thermal conductive substrate |
| abstract |
(57) [Problem] To provide a heat conductive substrate capable of sufficiently bringing out the performance of a heat transfer element and having high adhesive strength between an insulating layer and an electrode portion. An insulating layer including a porous portion chemically bonded to a surface of an aluminum metal substrate and having an opening end of a hole having an average diameter of 15 to 25 nm on an upper surface; Substrate consisting of provided electrodes. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013089798-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013102155-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2013251333-A |
| priorityDate |
1996-09-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |