| abstract |
(57) [Abstract] [Problem] Swelling in an electroless plating solution which is an alkaline aqueous solution, Provided is a photosensitive resin composition which can be plated without being dissolved and which can be exposed and developed by an incombustible aqueous developer. An epoxy resin having an epoxy equivalent of 250 to 500 g / eq and an epoxy equivalent of 160 to 250 g / eq. Epoxy resin, a resin having a phenolic hydroxyl group and soluble in an alkaline aqueous solution, and at least one inorganic compound selected from hydroxides, oxides and carbonates of the IIa group, IIIa group and IVa group, and A photosensitive resin composition comprising a photoacid generator. |