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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-336
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filingDate 1995-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f1cf8904dc978d75b7dff79c730d3078
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publicationDate 1997-03-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H0964348-A
titleOfInvention Method for manufacturing semiconductor device
abstract Kind Code: A1 Abstract: A method for manufacturing a semiconductor device is provided, which prevents a gate insulating film from being destroyed by avoiding accumulation of polarization charge generated in a resist during plasma etching. A gate electrode is formed on a gate insulating film of a MOS transistor, an interlayer insulating film deposited thereon is provided with an opening reaching the gate electrode, and a conductive film is formed on an upper surface including the opening. Manufacture of a semiconductor device in which wiring is formed by depositing and selectively dry-etching the conductive film using the resist formed on the conductive film as an etching mask to form a wiring made of the conductive film connected to the gate electrode. In the method, the resist is 1 × 10 10 Ω / □ It is a conductive resist having the following, for example, an aniline-based polymer. This resist can be formed by patterning a photoresist formed on a conductive polymer by selective exposure and development, and transferring the pattern of this photoresist to the conductive polymer.
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