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filingDate 1996-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ec2426937e35bc628d4ff85fea88f100
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publicationDate 1997-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H09232288-A
titleOfInvention Method of manufacturing semiconductor device and resist material
abstract (57) Abstract: In dry etching in which a gas containing halogen is introduced into an etching chamber, the gas is turned into plasma, and a semiconductor substrate is etched using a resist pattern formed in advance as a mask, the resist is the dry etching. A resist that generates any of silicon halide, aluminum halide, carbon monoxide, and oxygen is used. [Effect] Since the compound that will become the side wall protective film is also generated from the resist, side etching does not occur even in a portion where the layer of the semiconductor substrate to be processed is changed. In addition, since a gas that improves the etching selectivity is generated from the resist, the etching selectivity is improved without adding such a gas.
priorityDate 1996-02-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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