http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H09174763-A

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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-301
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00
filingDate 1995-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8a7e5a6b6424f13f0a9c4ece34eefcd3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a149c6c4aa17e9e4830ab6397890d491
publicationDate 1997-07-08-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H09174763-A
titleOfInvention Release film
abstract (57) [Abstract] [PROBLEMS] A protective film for a pressure-sensitive adhesive used in a dicing process in the production of silicon wafers, which uses a polyester film as a base film and suppresses the migration of impurities in the polyester film to the surface of the release layer. Provided is a release film which is useful for such purposes. PROBLEM TO BE SOLVED: To provide a primer layer having a thickness of 0.02 to 2 μm cross-linked with a silane coupling agent on at least one surface of a polyester film containing polyester as a main component obtained by using a germanium compound as a polycondensation reaction catalyst. A release film comprising a silicone release layer having a residual adhesion of 95% or more.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-20010006682-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2002105230-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2007021931-A
priorityDate 1995-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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