| abstract |
(57) [Summary] [PROBLEMS] To provide a boron nitride excellent in resin filling property and an adhesive sheet used for manufacturing a semiconductor circuit board and the like using the same. [Structure] A filler, characterized in that boron nitride is heated in an oxidizing atmosphere to increase the weight by 1 to 40%. When the filler is treated with a coupling agent, an infrared absorption spectrum by CH stretching vibration is obtained. And the difference between the weight reduction rate when heated to 200 ° C. and the weight reduction rate when heated to 600 ° C. is 1 to 20%. It is an adhesive sheet. [Effect] Adhesive sheet for circuit board manufacturing, which has a low dielectric constant, high thermal conductivity, and can be filled with boron nitride, which has excellent electrical insulation properties, more highly than before, and has excellent adhesion to resin and excellent heat resistance. Can be provided easily. |