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filingDate 1995-10-23-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 1997-05-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H09115851-A
titleOfInvention Impurity introduction method and apparatus, and semiconductor device manufacturing method
abstract (57) Abstract: When an inert or reactive gas is introduced into a vacuum chamber to generate an impurity from an impurity solid, the impurity is efficiently generated and a high concentration of impurities is generated on the surface portion of the solid sample. The impurity layer can be formed. An impurity solid 21 containing boron as an impurity and a solid sample 1 into which boron is introduced into a vacuum chamber 10. Hold 2 and. Ar gas is introduced into the vacuum chamber 10 to generate plasma of the Ar gas. A voltage is applied to the impurity solid 21 so that the impurity solid 21 becomes a cathode with respect to the plasma, and the impurity solid 21 is sputtered by the ions in the plasma. Mixed in the plasma. A voltage is applied to the solid sample 12 so that the solid sample 12 serves as a cathode with respect to the plasma, so that boron mixed in the plasma is introduced to the surface portion of the solid sample 12.
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