http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H0864580-A
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_294881271413951a95f284b588a68e66 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065 |
| filingDate | 1994-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_abb18267de8d0ec051743e91ff5649ad |
| publicationDate | 1996-03-08-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-H0864580-A |
| titleOfInvention | Method for manufacturing semiconductor device |
| abstract | (57) [Abstract] [Purpose] To prevent aluminum crown due to redeposition of spatter of the underlying metal wiring when a connection hole is formed in the interlayer insulating film on the metal wiring of Al-based metal or the like. [Structure] An antireflection film 2 is formed on the metal wiring 1 and is used as an etching stopper when the connection hole 5 is opened, as well as an original antireflection function when patterning the metal wiring 1. The exposed portion of the antireflection film 2 is removed by downflow plasma. [Effect] Since the ion energy of the downflow plasma is small, the exposed metal wiring is not sputtered. The effect is great when the connection holes having different depths are simultaneously opened. It is also possible to simultaneously ash the resist mask 4 with downflow plasma. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2006344749-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H11354644-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4515333-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2003051443-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2012023384-A |
| priorityDate | 1994-08-24-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
| Predicate | Subject |
|---|---|
| isDiscussedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419491804 http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5359268 |
Total number of triples: 20.