| abstract |
(57) [Abstract] [PROBLEMS] To provide a one-pack type solder resist composition capable of alkali development and a solder resist film excellent in heat resistance, adhesion, electroless plating resistance, electrical characteristics and the like obtained therefrom. (A) A polymer compound or oligomer which is solid at room temperature and has at least one or more free carboxyl groups in one molecule, or further has one or more photoreactive unsaturated groups, (B) ) A polyfunctional unsaturated compound and / or an organic solvent which is liquid at room temperature as a diluent, (C) a photopolymerization initiator, and (D) a melamine represented by the following general formula (1) or a derivative thereof, or Furthermore (E) 2, 4, A composition comprising 6-trimercapto-S-triazine, It is applied on the surface of a printed wiring board on which a circuit is formed, dried, and then selectively exposed according to a predetermined exposure pattern, and the unexposed portion is developed with an alkaline aqueous solution, and thereafter, only by irradiation with active energy rays or heat treatment, or Both treatments are finish-cured. Embedded image |