http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-4649212-B2
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B21J13-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B21J13-02 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| filingDate | 2005-01-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2011-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2011-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-4649212-B2 |
| titleOfInvention | Photo-curable thermosetting one-component solder resist composition and printed wiring board using the same |
| priorityDate | 2005-01-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 128.