| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4623
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-09701
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-1052
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-467
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68363
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68345
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10666
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-09527
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68359 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4857
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-205
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4614
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5385 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-538
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-68
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate |
1996-05-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3569b848be9c2d9ec86e696ca2052ffb
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7ea1f7083faaadf456cc0c115c29ffd3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9d64f4977654a13eef4049092725589b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6dc3a9db45476275c532be26acc86959 |
| publicationDate |
1996-12-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-H08330416-A |
| titleOfInvention |
Transfer method for thin film wiring layer |
| abstract |
Kind Code: A1 A method of transferring a thin film wiring layer that can eliminate the need for a conventional outer frame forming and aligning device for adhering an MLTF structure to an electronic package substrate. In a method of transferring a thin film wiring layer to a substrate having a multilayer chip module structure, first, a sacrificial peeling layer 22 is deposited on the surface of a carrier 20. This release layer 22 Directly above, a plurality of multi-layered thin film (MLTF) structures having wiring paths 24 made of at least one conductive material exposed on the surface opposite to the carrier 20 are formed in an inverted inverted state. An electronic package substrate 40 is also prepared and solder or other adhesive material is applied to either or both of the exposed metal surface of the multilayer thin film structure or the substrate 40. Then, the multilayer thin film structure is adhered to the substrate 40 so that the carrier 20 attached thereto is separated from the substrate 40. The release layer 22 is used to remove the carrier 20 from the multilayer thin film structure that produces the multilayer chip module. Is almost contacted with the etchant to remove the. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2015164189-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/KR-101053419-B1 |
| priorityDate |
1995-06-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |