| abstract |
(57) [Abstract] [Purpose] To provide a copper-clad laminate in which a copper foil and an insulating layer are firmly adhered to each other without roughening the copper foil. [Structure] A copper-clad laminate in which copper foils are laminated and adhered on one or both sides of a laminated base material, wherein (a) the following formula [1] is applied on the copper foils. (However, in the formula, Q is a functional group that reacts with the peroxide curable resin composition, R is a bonding group that connects Q and a silicon atom, X, Y and Z represent a hydrolyzable group or a hydroxyl group bonded to a silicon atom), or (b) peroxide curable via an adhesive base consisting of a silane coupling agent or a thiol coupling agent. The copper-clad laminate has a laminated base material adhered with an adhesive composed of a resin composition, or a laminated base material composed of a peroxide-curable resin composition and also serving as an adhesive is directly adhered. Embedded image QRSiXYZ ... [1] |