| abstract |
The invention discloses an epoxy resin composition, which comprises the following components in terms of solid weight: (A) epoxy resin: 100 parts; (B) curing agent: 1-100 parts; (C) filler: 0- 200 parts; (D) curing accelerator: 0.001-5 parts; the curing agent contains at least a thiol-based active ester compound. The present invention adopts an active ester compound containing a thiol group, wherein the active ester group does not generate a hydroxyl group with strong polarity when reacting with the epoxy resin, so as to obtain excellent dielectric properties and low roughness, and at the same time, the sulfur at the end is There is good adhesion between the alcohol group and the metal copper foil, so it solves the problems of two opposite properties of low roughness and high peel strength. Experiments show that the resin composition of the present invention has excellent low Roughness, high peel strength, dielectric properties and heat resistance, so it can be better applied to high multi-layer laminate circuit boards, so it has broad application prospects. |