abstract |
(57) [Summary] [Structure] An epoxy resin composition in which a semiconductor chip 1 is mounted on an auxiliary wiring board 2 and a gap between the semiconductor chip 1 and the auxiliary wiring board 2 contains the following (A) to (C): A semiconductor device sealed with a cured product 3. (A) Epoxy resin (B) Allylphenol resin represented by the following general formula (1): (C) Curing accelerator [Effect] The cured body 3 of the epoxy resin composition is firmly adhered to the semiconductor chip 1 and the auxiliary wiring board 2, and as a result, the reliability of the semiconductor device becomes excellent. |