| abstract |
(57) [Abstract] [Purpose] Alumina, which has a low material cost, is used as the main material, and its mechanical strength, especially fracture toughness (flexibility), is increased, which allows the heat dissipation to be improved by making the substrate itself thinner. To provide a substrate for a semiconductor device, which is a ceramic substrate as described above. [Structure] A ceramic substrate has alumina as a main component to which zirconia is added, and further, as a ceramics sintering aid, one of yttria, calcia, magnesia, and ceria is 0.1 to 2 wt% and 0.02%, respectively. ~ 0.5 wt%, 0.02-0.4 wt%, 0.02- It is a high temperature fired body added with 0.5 wt%. In particular, the bending strength is significantly increased compared to a ceramic substrate made of alumina alone. Moreover, the thermal conductivity is further improved. Thus, by thinning the substrate itself, a CBC substrate having excellent heat dissipation can be obtained as a substrate of a semiconductor device. |