http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H08139004-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_294881271413951a95f284b588a68e66
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3065
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-302
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-027
filingDate 1994-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_abb18267de8d0ec051743e91ff5649ad
publicationDate 1996-05-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-H08139004-A
titleOfInvention Plasma processing apparatus and plasma processing method
abstract (57) [Summary] [Object] To provide a high throughput, clean and low damage ashing device and ashing method for a resist mask having a hardened and altered layer formed by high-dose ion implantation or the like. [Structure] A cured alteration layer is ashed by a plasma processing apparatus having a helicon wave plasma generation source having a transparent bell jar 6 made of a dielectric material transparent to UV light, and then the substrate 1 to be processed is irradiated with UV light irradiating means 7 And ash the unaltered layer of the resist mask by irradiating UV light in ozone. [Effect] With one high-density plasma processing apparatus, high-density ion mode ashing processing and vapor-phase processing without ions are possible, and high-throughput residue-free ashing is possible. The resist mask ashing after the Al-based metal layer patterning and the passivation film forming treatment can be continuously performed.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2008116615-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8187389-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2010056332-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I736829-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2011131149-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-2009200317-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-H10223606-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8574369-B2
priorityDate 1994-11-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID2244
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559478
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419556224
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID449360014
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID24681
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID24823

Total number of triples: 26.