| abstract |
(57) [Summary] [Object] To provide a polyamide-imide resin composition having improved heat resistance without impairing the good processability inherent to the polyamide-imide resin. [Structure] A metal oxide sol is dispersed in a polyamide-imide resin, and a preferable particle size of the metal oxide sol is 10 A heat resistant resin composition having a thickness of -100 nm. [Effect] Since the heat-resistant resin composition of the present invention uniformly disperses the metal oxide sol in the polyamide-imide resin, the heat-softening property (at high temperature) without impairing the good processability originally possessed by the polyamide-imide resin. (E.g., elastic modulus), thermal dimensional stability, thermal decomposition characteristics, and other heat resistance can be improved. |